Polyamide Hot Melt Adhesive (PA)

The polyamide is PA, a polymer material with a complex and regular structure. Recently, people have successfully produced polyamide hot melt adhesives through the use of various modifications.

Polyamide hot melt adhesive pellets are the result of a condensation reaction between dimer acid and polyamine in a high temperature. The dimer acid with its excellent heat stability offers the polyamide an excellent heat and cold temperature resistance. Our adhesive has also a number of advantages, including a narrow softening point range. This means the adhesive can melt even when the temperature is slightly lower than the melting point. PA adhesive with an excellent high temperature resistance is ideal for high temperature bonding applications.

Because polyamide materials include polyamine with an excellent water absorption performance, in order to ensure the polyamide's performance, we offer a waterproof packaging, and users should store the adhesive in dry conditions.