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Electronics Manufacturing (hot melt adhesive for wiring and PCB bonding)

Hot melt adhesive pellets and stick are widely used to position, bond and seal electrical components, and in the process of low pressure molding for the protection of electric wires and cables.

The following hot melt adhesives we recommend offer good viscosity and their viscosity will remain unchanged whether in high or low temperature conditions. This significantly reduces the influence of temperature changes resulting from electrical current.

Application
  • Glue stick and adhesive pellets are used for the bonding and positioning of electric components
  • Glue stick and adhesive pellets are used for bonding electric wires
  • Adhesive pellets are used for positioning circuit boards
  • Moisture curing PUR hot melt adhesive is used for sealing mobile phone frames
  • Hot melt adhesive pellets are used to make heat-shrinkable tube liners
  • Hot melt glue pellets are used for low pressure molding
Examples
Recommended products 1. Hot melt glue pellets
Model 8620M(low pressure molding) 8620BM(low pressure molding) 8640M(heat-shrinkable sleeving)

Appearance Buff, transparent, pellet Black, non-transparent, pellet Buff, transparent, pellet
Hardness / / 40~50A
Viscosity 2000cps~4800cps/200℃ 2000cps~4800cps/200℃ 1300cps~5500cps/200℃
Softening point 115℃~125℃ 115℃~125℃ 140℃~145℃
Operation temperature 140℃~180℃ 140℃~180℃ 140℃~180℃
Glass transition temperature -40℃ -40℃ -40℃
Curing speed 3s~6s 3s~6S 2s~5s
Density 0.95g/cm3 0.98g/cm3 0.95g/cm3
Acid value < 6mg(KOH)/g < 7mg(KOH)/g < 6mg(KOH)/g
Amine value < 3mg(HCL)/g < 3mg(HCL)/g < 6mg(HCL)/g
Weight/per 25kg/sack paper bag 25kg/sack paper bag 25kg/sack paper bag
Model 8650BM(low pressure molding) 8675M 8675BM(low pressure molding

Appearance Black, non-transparent, pellet Buff, transparent, pellet Black, non-transparent, pellet
Hardness 88A 92A 92A
Viscosity 2200cps~3500cps/200℃ 2500cps~4500cps/200℃ 2500cps~4500cps/200℃
Softening point 150℃ 175℃±5℃ 175℃±5℃
Operation temperature 180℃~200℃ 200℃~220℃ 200℃~220℃
Glass transition temperature -20℃ -40℃ -40℃
Endurable environmental temperature / -40℃~150℃ -40℃~150℃
Curing speed 1s~3s 3s~5s 3s~5s
Oxidation resistance / 200℃/5h 200℃/5h
Elongation / 500%~600% 500%~600%
Shrinkage rate / < 1% < 1%
Water absorption / < 1% < 1%
Density 0.98g/cm3 0.95g/cm3 0.95g/cm3
Acid value < 2.2mg(KOH)/g < 6mg(KOH)/g < 6mg(KOH)/g
Amine value < 6.7mg(HCL)/g < 3mg(HCL)/g < 3mg(HCL)/g
Weight/per 25kg/sack paper bag 25kg/sack paper bag 25kg/sack paper bag
Model 8121M 8122M 8142GM

Appearance Buff, transparent, pellet Buff, transparent, pellet Buff, transparent, pellet
Hardness / / /
Viscosity 2000cps~4000cps/200℃ 2000cps~4000cps/200℃ 2000cps~4000cps/200℃
Softening point 115℃~125℃ 115℃~125℃ 135℃~145℃
Operation temperature 180℃~200℃ 170℃~190℃ 170℃~190℃
Glass transition temperature -5℃ -8℃ -8℃
Curing speed 4s~8s 3s~5S 3s~5s
Density 0.95g/cm3 0.95g/cm3 0.95g/cm3
Acid value < 7mg(KOH)/g < 6mg/g < 6mg/g
Amine value < 3mg(HCL)/g < 6mg/g < 3mg/g
Weight/per 25kg/sack paper bag 25kg/sack paper bag 25kg/sack paper bag
2. Hot melt adhesive stick
Model 8120BN 8620N 5003N 5003NQH

Appearance Black, non-transparent, stick Yellow, transparent, stick semi-transparent white glue stick semi-transparent white glue stick
Hardness / / / /
Viscosity 1800cps~3500cps/200℃ 2000cps~4500cps/200℃ 3500cps~4500cps/180℃ 1500cps~4500cps/180℃
Softening point 115℃~125℃ 125℃±5℃ 75℃~85℃ 80℃~90℃
Operation temperature 160℃~190℃ 180℃~200℃ 160℃~180℃/150℃~170℃ 160℃~180℃
Glass transition temperature 0℃ -40℃ -5℃ -5℃
Curing speed 3s~5s 5s~10s 10s~20s 8s~15s
Density 0.95g/cm3 / 0.92g/cm3 0.92g/cm3
Acid value / / / /
Amine value / / / /
Weight/per carton 25kg/carton 25kg/carton 25kg/carton 25kg/carton